Xiaomi Mix Flip was launched in July 2024 as the company’s first clamshell-style foldable phone. The Chinese firm is already said to be working on its potential successor dubbed the Xiaomi Mix Flip 2 and several of its specifications have now surfaced. It is tipped to be powered by Qualcomm’s Snapdragon 8 Elite chipset and may come with changes to the camera system, with an ultra-wide angle lens replacing the telephoto sensor.
Xiaomi Mix Flip 2 Specifications (Leaked)
This information comes from Digital Chat Station’s post, translated from Chinese, via GSMArena, on the Chinese social media platform Weibo. According to the tipster, the purported Xiaomi Mix Flip 2 will pack a 6.85-inch LTPO OLED inner display with a 1.5K resolution. The phone is said to feature an IPX8 splash resistance rating — an upgrade over the Mix Flip which did not have any dust or water resistance rating.
Speaking of optics, the Mix Flip 2 may use a similar rear dual-camera system, but slightly different. It offered a 50MP Light Fusion 800 main shooter along with another 50MP Omnivision OV60A40 sensor paired with a telephoto lens for up to 2x optical zoom on its predecessor.
However, the tipster suggests that the telephoto camera could be replaced with an ultra-wide angle lens. It is tipped to have a 50-megapixel primary camera with a 1/1.5-inch sensor and a 50-megapixel 1/2.76-inch ultra-wide angle sensor.
The handset is also said to have a side-mounted fingerprint sensor most likely situated on the power button and NFC support. The purported Mix Flip 2 is also claimed to sport a similarly large cover screen as its predecessor that came with a 4.01-inch 1.5K flexible AMOLED panel.
Despite these, it is best for readers to take all information with a grain of salt until more concrete details surface or there is official confirmation from the company about the handset.
